An investigation of electromigration induced void nucleation time statistics in short copper interconnects
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.3309744
Reference53 articles.
1. Electromigration characterization of damascene copper interconnects using normally and highly accelerated tests
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4. Statistical Metallurgical Model for Electromigration Failure in Aluminum Thin‐Film Conductors
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