HierPINN-EM-Reference-Cited by-同舟云学术

HierPINN-EM

Published:2022-10-30 Issue: Volume: Page:
ISSN:
Container-title:Proceedings of the 41st IEEE/ACM International Conference on Computer-Aided Design
language:
Short-container-title:

Author:

Jin Wentian¹,Chen Liang¹,Lamichhane Subed¹,Kavousi Mohammadamir¹,Tan Sheldon X.-D.¹

Affiliation:

1. University of California

Funder

National Science Foundation

Publisher

ACM

Link

https://dl.acm.org/doi/pdf/10.1145/3508352.3549371

Reference38 articles.

1. Electromigration—A brief survey and some recent results

2. Electromigration in thin aluminum films on titanium nitride

3. M. Hauschildt , C. Hennesthal , G. Talut , O. Aubel , M. Gall , K. B. Yeap , and E. Zschech , " Electromigration Early Failure Void Nucleation and Growth Phenomena in Cu And Cu(Mn) Interconnects," in IEEE Int . Reliability Physics Symposium (IRPS) , 2013 , pp. 2C .1.1--2C.1.6. M. Hauschildt, C. Hennesthal, G. Talut, O. Aubel, M. Gall, K. B. Yeap, and E. Zschech, "Electromigration Early Failure Void Nucleation and Growth Phenomena in Cu And Cu(Mn) Interconnects," in IEEE Int. Reliability Physics Symposium (IRPS), 2013, pp. 2C.1.1--2C.1.6.

4. Beyond Black’s equation: Full-chip EM/SM assessment in 3D IC stack

5. Physically based models of electromigration: From Black’s equation to modern TCAD models

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. PostPINN-EM: Fast Post-Voiding Electromigration Analysis Using Two-Stage Physics-Informed Neural Networks;2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD);2023-10-28

2. Fast and Accurate Electromigration Analysis of Multi-Segment Wires;2023 International Symposium of Electronics Design Automation (ISEDA);2023-05-08