Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Cited by
41 articles.
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1. PostPINN-EM: Fast Post-Voiding Electromigration Analysis Using Two-Stage Physics-Informed Neural Networks;2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD);2023-10-28
2. Fast Electromigration Simulation for Chip Power Grids;2023 24th International Symposium on Quality Electronic Design (ISQED);2023-04-05
3. Recent Progress in the Analysis of Electromigration and Stress Migration in Large Multisegment Interconnects;Proceedings of the 2023 International Symposium on Physical Design;2023-03-26
4. HierPINN-EM;Proceedings of the 41st IEEE/ACM International Conference on Computer-Aided Design;2022-10-30
5. An Efficient Test Strategy for Detection of Electromigration Impact in Advanced FinFET Memories;2022 IEEE International Test Conference (ITC);2022-09