Modeling the electromigration failure time distribution in short copper interconnects
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.2970171
Reference36 articles.
1. Dependence of the electromigration flux on the crystallographic orientations of different grains in polycrystalline copper interconnects
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5. Effect of contact metallization on electromigration reliability of Pb-free solder joints
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