The role of texture in the electromigration behavior of pure aluminum lines
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.361168
Reference51 articles.
1. Grain Growth in Thin Films
2. Texture Evolution During Grain Growth of Aluminum Films
3. Texture in multilayer metallization structures
4. Effects of microstructure on interconnect and via reliability: Multimodal failure statistics
5. Relationship between texture and electromigration lifetime in sputtered AI-1% Si thin films
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