Effect of the underlayer on the microstructure and surface evolution in Al-0.5wt.%Cu polycrystalline thin films-Reference-Cited by-同舟云学术

Effect of the underlayer on the microstructure and surface evolution in Al-0.5wt.%Cu polycrystalline thin films

Published:2002-01 Issue:1 Volume:31 Page:55-65
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Lita Adriana E.,Sanchez John E.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-002-0173-9.pdf

Reference29 articles.

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5. K.P. Rodbell, V. Svilan, L.M. Gignac, P.W. Dehaven, R.J. Murphy, and T.M. Licata, Materials Reliability in Microelectronics VI, Conf. Proc., ed. W.F. Filter, J. Clement, A. Oates, R. Rosenberg, and P.M. Lenahan (Pittsburgh, PA: Materials Research Society, 1996), vol. 428, pp. 261–271.

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