Author:
Alam M.O.,Chan Y.C.,Tu K.N.
Abstract
Systematic experimental work was carried out to understand the mechanism of Au diffusion to the solder interface, and a novel method was proposed to eliminate Au embrittlement by circumventing the continuous layer of (Au,Ni)Sn4 at the solder interface. Contrary to the usual expectation, it was determined that utilization of a very thin Ni metallization in the Au/Ni/Cu under bump metallization (UBM) was an effective means of maintaining mechanical integrity of the solder joint. It was found that the out-diffusion of Cu during the aging period changes the chemistry and morphology of the intermetallic compounds at the interface.
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Cited by
50 articles.
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