Elimination of Au-embrittlement in solder joints on Au/Ni metallization

Abstract

Systematic experimental work was carried out to understand the mechanism of Au diffusion to the solder interface, and a novel method was proposed to eliminate Au embrittlement by circumventing the continuous layer of (Au,Ni)Sn4 at the solder interface. Contrary to the usual expectation, it was determined that utilization of a very thin Ni metallization in the Au/Ni/Cu under bump metallization (UBM) was an effective means of maintaining mechanical integrity of the solder joint. It was found that the out-diffusion of Cu during the aging period changes the chemistry and morphology of the intermetallic compounds at the interface.