Author:
Lee Jong-Hyun,Park Jong-Hwan,Lee Yong-Ho,Kim Yong-Seog
Abstract
Effects Cu and Ni additions on Au embrittlement of eutectic Sn–Pb solder interconnections during a solid-state aging treatment were evaluated using a ball shear testing method. The addition resulted in a formation of Au-containing ternary intermetallic compounds, either Au–Sn–Cu or Au–Sn–Ni phase, inside the solder matrix during aging treatment. The fracture energy of the solder interconnection containing 2.9 wt% Cu remained almost the same up to 200 h of aging treatment at 150 °C, demonstrating the possibility of suppressing the Au embrittlement by forming ternary intermetallic phases inside the solder matrix.
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Cited by
22 articles.
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