Effect of Ni and Pd Addition on Mechanical, Thermodynamic, and Electronic Properties of AuSn4-Based Intermetallics: A Density Functional Investigation-Reference-Cited by-同舟云学术

Effect of Ni and Pd Addition on Mechanical, Thermodynamic, and Electronic Properties of AuSn4-Based Intermetallics: A Density Functional Investigation

Published:2016-05-10 Issue:8 Volume:45 Page:4138-4147
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Tian Yali,Zhou Wei,Wu Ping

Funder

National Natural Science Foundation of China

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-016-4592-4.pdf

Reference35 articles.

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3. C.E. Ho, R. Zheng, G.L. Luo, A.H. Lin, and C.R. Kao, J. Electron. Mater. 29, 1175 (2000).

4. T.J. Chung, W.H. Moon, Y.G. Park, M.C. Kim, and C.K. Choi, Intermetallics 18, 1228 (2010).

5. C.E. Ho, Y.C. Lin, and S.J. Wang, Thin Solid Films 544, 551 (2013).

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