Interactions between solder and metallization during long-term aging of advanced microelectronic packages-Reference-Cited by-同舟云学术

Interactions between solder and metallization during long-term aging of advanced microelectronic packages

Published:2001-04 Issue:4 Volume:30 Page:379-385
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Ho C. E.,Chen W. T.,Kao C. R.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-001-0047-6.pdf

Reference10 articles.

1. C. E. Ho, R. Zheng, G. L. Luo, A.H. Lin, and C.R. Kao, J. Electron. Mater. 29, 1175 (2000).

2. C. E. Ho, Y. M. Chen, and C. R. Kao, J. Electron. Mater. 28, 1231 (1999).

3. S. Anhöck, H. Oppermann, C. Kallmayer, R. Aschenbrenner, L. Thomas, and H. Reichl, 1998 IEEE/CPMT Berlin Intl Manufacturing Tech. Symp. Proc. Piscataway, NJ: IEEE, 1998), p. 156.

4. K. Banerji and R. F. Darveaux, Microstructures and Mechanical Properties of Aging Materials, ed. P. K. Liaw et al. (Warrendale, PA: TMS, 1993), p. 431.

5. R. F. Darveaux, K. Banerji, A. Mawer, and G. Dody, Ball Grid Array Technology, ed. J. K. Lau (New York, McGraw-Hill, 1995), p. 379.

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