First-principles investigation of the structural and electronic properties of Cu6−xNixSn5 (x=0, 1, 2) intermetallic compounds
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials,General Chemistry
Reference37 articles.
1. Polarity effect of electromigration on kinetics of intermetallic compound formation in Pb-free solder V-groove samples
2. High electric current density-induced interfacial reactions in micro ball grid array (μBGA) solder joints
3. Effects of fourth alloying additive on microstructures and tensile properties of Sn–Ag–Cu alloy and joints with Cu
4. Prevention of electromigration-induced Cu pad dissolution by using a high electromigration-resistance ternary Cu–Ni–Sn layer
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