Reflow characteristics of Sn-Ag matrix in-situ composite solders-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Reflow characteristics of Sn-Ag matrix in-situ composite solders

Published:2000-03 Issue:8 Volume:42 Page:827-831
ISSN:1359-6462
Container-title:Scripta Materialia
language:en
Short-container-title:Scripta Materialia

Author:

Lee Jong-Hyun,Park Dea-Jin,Heo Jung-Na,Lee Yong-Ho,Shin Dong-Hyuk,Kim Yong-Seog

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Materials Science,Mechanics of Materials,Metals and Alloys,Mechanical Engineering

Reference18 articles.

1. Microstructural evolution during thermomechanical fatigue of 62Sn-36Pb-2Ag and 60Sn-40Pb solder joints

2. Mechanical characteristics of 96.5 Sn/3.5 Ag solder in microbonding

Cited by 32 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of Cetyl Trimethyl ammonium bromide (CTAB) amount on the Nanoindentation creep behaviour of Sn-cu-Y2O3 nanocomposite Lead-free solder;Materials Characterization;2024-06

2. Enhancing performance of Sn–Ag–Cu alloy through germanium additions: Investigating microstructure, thermal characteristics, and mechanical properties;Materials Today Communications;2024-03

3. Main application limitations of lead-free composite solder doped with foreign reinforcements;Journal of Materials Science: Materials in Electronics;2021-09-14

4. Magnetic solder to reduce porosity of solder joints formed in microgravity;Acta Astronautica;2021-01

5. Controlling Ag3Sn Plate Formation and Its Effect on the Creep Resistance of Sn–3.0Ag–0.7Cu Lead-Free Solder by Adding Minor Alloying Elements Fe, Co, Te and Bi;Metals and Materials International;2020-08-31

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3