Controlling Ag3Sn Plate Formation and Its Effect on the Creep Resistance of Sn–3.0Ag–0.7Cu Lead-Free Solder by Adding Minor Alloying Elements Fe, Co, Te and Bi-Reference-Cited by-同舟云学术

Controlling Ag3Sn Plate Formation and Its Effect on the Creep Resistance of Sn–3.0Ag–0.7Cu Lead-Free Solder by Adding Minor Alloying Elements Fe, Co, Te and Bi

Published:2020-08-31 Issue:10 Volume:27 Page:4294-4305
ISSN:1598-9623
Container-title:Metals and Materials International
language:en
Short-container-title:Met. Mater. Int.

Author:

El-Taher A. M.^ORCID,Razzk A. F.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Link

https://link.springer.com/content/pdf/10.1007/s12540-020-00856-w.pdf

Reference48 articles.

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2. M.N. Collins, E. Dalton, J. Punch, Microstructural influences on thermomechanical fatigue behaviour of third generation high Ag content Pb-free solder alloys. J. Alloys Compd. 688, 164–170 (2016)

3. O.M. Abdelhadi, L. Ladani, IMC growth of Sn–3.5Ag/Cu system: combined chemical reaction and diffusion mechanisms. J. Alloys Compd. 537, 87–99 (2012)

4. J.H. Lee, D.J. Park, J.N. Heo, Y.H. Lee, D.H. Shin, Y.S. Kim, Reflow characteristics of Sn–Ag matrix in situ composite solders. Scr. Mater. 42, 827–831 (2000)

5. M. Kerr, N. Chawla, Creep deformation behavior of Sn–3.5Ag solder/Cu couple at small length scales. Acta Mater. 52, 4527–4535 (2004)

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