Microstructural influences on thermomechanical fatigue behaviour of third generation high Ag content Pb-Free solder alloys-Reference-Cited by-同舟云学术

Microstructural influences on thermomechanical fatigue behaviour of third generation high Ag content Pb-Free solder alloys

Published:2016-12 Issue: Volume:688 Page:164-170
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Collins Maurice N.^ORCID,Dalton Eric,Punch Jeff

Funder

European Space Agency

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference26 articles.

1. The influence of the Pb-free solder alloy composition and processing parameters on thermal fatigue performance of a ceramic chip resistor;Coyle,2009

2. High thermo-mechanical fatigue and drop impact resistant Ni-Bi doped lead free solder;Jae Hong,2014

3. A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products;Shnawah;Microelectron. Reliab.,2012

4. Properties enhancement of SnAgCu solders containing rare earth Yb;Zhang;Mater. Des.,2014

5. SnZn Solder Alternative for Low-cost Pb-free Surface Mount Assemblies in SMTA International;Jackson,2012

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