Interface evolution and mechanical properties of Sn–36Pb–2Ag solder joints under different aging conditions
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites
Reference31 articles.
1. Brittle fracture of Sn-37Pb solder joints induced by enhanced intermetallic compound growth under extreme temperature changes;Tian;J Mater Process Technol,2019
2. Wetting and spreading of molten SnPb solder on a Cu-10%Nb micro-composite;Yeo;J Alloys Compd,2009
3. The effects of aging temperature on SAC solder joint material behavior and reliability;Zhang;Electron Compon C,2008
4. Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term aging;Choi;J Electron Mater,1999
5. Electromigration-induced cracks in eutectic SnPb solder reaction couple at room temperature;Xu;J Mater Sci Mater Electron,2009
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