Author:
Yankov R. A.,Hatzopoulos N.,Fukarek W.,Voelskow M.,Heera V.,Pezoldt J.,Skorupa W.
Abstract
AbstractSolid solutions of SiC and III-V compound semiconductors are recognized as promising materials for novel semiconductor applications. This paper reports on experiments which explore the possibility of synthesizing thin buried layers of (SiC)l-x(AIN)x having composition of about x = 0.2 by co-implanting N+ and Al+ ions into 6H-SiC wafers maintained at temperatures in the range 200 - 800°C. Structural and compositional evaluation of as-implanted samples was carried out using a combination of Rutherford backscattering/channelling spectrometry and infrared reflectance spectroscopy. It is shown that the structures are highly sensitive to the substrate temperature. The use of sufficiently high temperatures (400 - 800°C) enables the crystallinity of the host material as well as relatively low damage levels to be maintained during implantation. The formation of AI-N bonds within the implanted layers is also confirmed over the temperature range studied.
Publisher
Springer Science and Business Media LLC
Cited by
12 articles.
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