Utilization of a Porous Cu Interlayer for the Enhancement of Pb-Free Sn-3.0Ag-0.5Cu Solder Joint
Author:
Publisher
MDPI AG
Subject
General Materials Science,Metals and Alloys
Link
http://www.mdpi.com/2075-4701/6/9/220/pdf
Reference36 articles.
1. The Current Status of Lead-Free Soldering;Suganuma;ESPEC Technol. Rep.,2002
2. High-temperature lead-free solder alternatives
3. High-Reliability Low-Ag-Content Sn-Ag-Cu Solder Joints for Electronics Applications
4. Microstructural stability of Sn–1Ag–0.5Cu–xAl (x=1, 1.5, and 2wt.%) solder alloys and the effects of high-temperature aging on their mechanical properties
5. Solid state interaction between a Sn–Ag–Cu–In solder alloy and Cu substrate
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