Solid state interaction between a Sn–Ag–Cu–In solder alloy and Cu substrate
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials,General Chemistry
Reference32 articles.
1. Six cases of reliability study of Pb-free solder joints in electronic packaging technology;Zeng;Mater Sci Eng R,2002
2. Interfacial reactions between lead-free solders and common base materials;Laurila;Mater Sci Eng R,2005
3. Experimental determination and thermodynamic calculation of the phase equilibria in the Cu–In–Sn system;Liu;J Electron Mater,2001
4. Effect of In addition on Sn-3.5Ag solder and joint with Cu substrate;Choi;Mater Trans,2001
5. Experimental determination and thermodynamic calculation of the phase equilibria and surface tension in the Sn–Ag–In system;Liu;J Electron Mater,2002
Cited by 14 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Interfacial IMC growth behavior of Sn-3Ag-3Sb-xIn solder on Cu substrate;Soldering & Surface Mount Technology;2024-08-13
2. Effects of In and Ga on Spreading Performance of Ag10CuZnSn Brazing Filler Metal and Mechanical Properties of the Brazed Joints;Crystals;2023-11-19
3. Combined Effect of In and Ce on Microstructure and Properties of Ag10CuZnSn Low-Silver Brazing Filler Metals;Crystals;2023-08-20
4. Phase Field Simulation of Intermetallic Compound Evolution at the Interface of Copper–Tin Coating Under Thermal–Mechanical–Electrical Diffusion Coupling;Journal of Electronic Materials;2023-03-03
5. Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Review;Materials;2022-02-15
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3