Effect of In Addition on Sn-3.5Ag Solder and Joint with Cu Substrate
Author:
Affiliation:
1. Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology
2. Present address: Module/Package Team, Semiconductor Research Division, Hyundai Electronics Industries Co., Ltd.
Publisher
Japan Institute of Metals
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
https://www.jstage.jst.go.jp/article/matertrans/42/5/42_5_783/_pdf
Reference21 articles.
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3. 3) M. McCormack, G. W. Kammlott, H. S. Chen and S. Jin: Appl. Phys. Lett. 65 (1994) 1233–1235.
4. 4) U. R. Kattner and W. J. Boettinger: JEM 23 (1994) 603–610.
5. 5) J. Glazer: JEM 23 (1994) 693–713.
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