Wetting Characteristics of Al-containing Sn-1Ag-0.5Cu Solder Alloy on Cu Substrate using Wetting Balance and Spread area Methods
Author:
Publisher
Elsevier BV
Subject
General Earth and Planetary Sciences,General Environmental Science
Reference26 articles.
1. Effect of Ag Content and the Minor Alloying Element Fe on the Mechanical Properties and Microstructural Stability of Sn-Ag-Cu Solder Alloy Under High-Temperature Annealing
2. The bulk alloy microstructure and tensile properties of Sn‐1Ag‐0.5Cu‐xAl lead‐free solder alloys (x=0, 1, 1.5 and 2 wt.%)
3. Effects of thermal annealing in the post-reflow process on microstructure, tin crystallography, and impact reliability of Sn–Ag–Cu solder joints
4. Influence of cerium addition on microstructure and properties of Sn–Cu–(Ag) solder alloys
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3. Study on the correlation between spreadability and wetting driving force of Ni-GNSs reinforced SnAgCuRE composite solder;Materials & Design;2021-12
4. A study on wettability and formation of intermetallic phase between Co–Cr–Mo alloy and Sn-Solder used as a potential under bump metallization for flip-chip packages;Intermetallics;2020-10
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