Effect of Ag Content and the Minor Alloying Element Fe on the Mechanical Properties and Microstructural Stability of Sn-Ag-Cu Solder Alloy Under High-Temperature Annealing-Reference-Cited by-同舟云学术

Effect of Ag Content and the Minor Alloying Element Fe on the Mechanical Properties and Microstructural Stability of Sn-Ag-Cu Solder Alloy Under High-Temperature Annealing

Published:2012-12-08 Issue:3 Volume:42 Page:470-484
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Shnawah Dhafer Abdulameer,Sabri Mohd Faizul Mohd,Badruddin Irfan Anjum,Said Suhana Binti Mohd,Ariga Tadashi,Che Fa Xing

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-012-2343-8.pdf

Reference64 articles.

1. T.T. Mattila and J.K. Kivilahti, J. Electron. Mater. 35, 250 (2006).

2. D.Y.R. Chong, F.X. Che, J.H.L. Pang, K. Ng, J.Y.N. Tan, and P.T.H. Low, Microelectron. Reliab. 46, 1160 (2006).

3. E.H. Wong, S.K.W. Seah, and V.P.W. Shim, Microelectron. Reliab. 48, 1747 (2008).

4. B. Zhang, H. Ding, and X. Sheng, Microelectron. Reliab. 49, 530 (2009).

5. J.-W. Kim, D.-G. Kim, W.S. Hong, and S.-B. Jung, J. Electron. Mater. 34, 1550 (2005).

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