Effects of thermal annealing in the post-reflow process on microstructure, tin crystallography, and impact reliability of Sn–Ag–Cu solder joints
Author:
Funder
National Science Council Taiwan
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference37 articles.
1. C.A. Palesko, E.J. Vardaman, in: Proceedings of Electronic Components and Technology Conference (ECTC), 2010, pp. 10–13.
2. The influence of a small amount of Al and Ni nano-particles on the microstructure, kinetics and hardness of Sn–Ag–Cu solder on OSP-Cu pads
3. Electromigration Failure Mechanism in Sn-Cu Solder Alloys with OSP Cu Surface Finish
4. Solid-state interfacial reactions at the solder joints employing Au/Pd/Ni and Au/Ni as the surface finish metallizations
5. Effects of Minor Ni Doping on Microstructural Variations and Interfacial Reactions in Cu/Sn-3.0Ag-0.5Cu-xNi/Au/Ni Sandwich Structures
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