Effects of thermal annealing in the post-reflow process on microstructure, tin crystallography, and impact reliability of Sn–Ag–Cu solder joints
Author:
Funder
National Science Council Taiwan
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference37 articles.
1. C.A. Palesko, E.J. Vardaman, in: Proceedings of Electronic Components and Technology Conference (ECTC), 2010, pp. 10–13.
2. The influence of a small amount of Al and Ni nano-particles on the microstructure, kinetics and hardness of Sn–Ag–Cu solder on OSP-Cu pads
3. Electromigration Failure Mechanism in Sn-Cu Solder Alloys with OSP Cu Surface Finish
4. Solid-state interfacial reactions at the solder joints employing Au/Pd/Ni and Au/Ni as the surface finish metallizations
5. Effects of Minor Ni Doping on Microstructural Variations and Interfacial Reactions in Cu/Sn-3.0Ag-0.5Cu-xNi/Au/Ni Sandwich Structures
Cited by 18 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Photothermal effects on low-temperature hybrid solder joints and its superior drop reliability;Materials Characterization;2024-10
2. Microstructural Evolution and Mechanical Drop Reliability of Hybrid Solder Joints Via Intense Pulsed Light Soldering on Enig and Enepig Pcbs;2024
3. Study of microstructure, growth orientations and shear performance of Cu/Sn-3.0Ag-0.5Cu/Cu solder joints by using thermal gradient bonding;Materials Characterization;2023-09
4. Study on Electromigration Mechanism of Lead-Free Sn3.5Ag0.5Bi8.0In Solder Joints;Journal of Electronic Materials;2022-11-27
5. Process dependence and nucleus models of β-Sn grains in SAC305 freestanding solder balls and BGA solder joints;Journal of Materials Processing Technology;2022-04
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3