Recent Studies in the Development of Ceramic-Reinforced Lead-Free Composite Solder
Author:
Publisher
Springer International Publishing
Link
https://link.springer.com/content/pdf/10.1007/978-3-030-93441-5_1
Reference59 articles.
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4. Chang, S. Y., Jain, C. C., Chuang, T. H., Feng, L. P., & Tsao, L. C. (2011). Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3. 5AgXCu solder. Materials & Design, 32(10), 4720–4727. https://doi.org/10.1016/j.matdes.2011.06.044.
5. Cheng, S., Huang, C.-M., & Pecht, M. (2017). A review of lead-free solders for electronics applications. Microelectronics Reliability, 75, 77–95.
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