Author:
Bang Junghwan,Yu Dong-Yurl,Ko Yong-Ho,Son Jun-Hyuk,Nishikawa Hiroshi,Lee Chang-Woo
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference34 articles.
1. Solder Joint Technology: Materials, Properties, and Reliability,2007
2. Six cases of reliability study of Pb-free solder joints in electronic packaging technology;Zeng;Mater. Sci. Eng. R,2005
3. Growth behavior of intermetallic compounds at Sn–Ag/Cu joint interfaces revealed by 3D imaging;Zhang;J. Alloys Compd.,2015
4. Characterization of the microstructure of tin-silver lead free solder;Hurtony;J. Alloys Compd.,2016
5. Improvement in thermomechanical reliability of low vost Sn-based BGA interconnects by Cr addition;Bang;J. of METALS.,2018
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