Author:
Abdul‐Ameer Shnawah Dhafer,Faizul Mohd Sabri Mohd,Anjum Badruddin Irfan,Xing Che Fa
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference14 articles.
1. Lead-free Solders in Microelectronics
2. Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stability
3. Drop impact reliability testing for lead-free and lead-based soldered IC packages
4. The influence of addition of Al nano-particles on the microstructure and shear strength of eutectic Sn–Ag–Cu solder on Au/Ni metallized Cu pads
5. Huang, B., Hwang, H.‐S. and Lee, N.‐C. (2007), “A compliant and creep resistant SAC‐Al (Ni) alloy”,Proceedoing of the ECTC, IEEE, New York, NY, p. 184.
Cited by
10 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献