A Ballistic Transport and Surface Reaction Model for Simulating Atomic Layer Deposition Processes in High-Aspect-Ratio Nanopores
Author:
Publisher
Wiley
Subject
Process Chemistry and Technology,Surfaces and Interfaces,General Chemistry
Reference20 articles.
1. Batch ALD: Characteristics, comparison with single wafer ALD, and examples
2. A Kinetic Model for Step Coverage by Atomic Layer Deposition in Narrow Holes or Trenches
3. Modeling the Conformality of Atomic Layer Deposition: The Effect of Sticking Probability
4. Conformal Coating on Ultrahigh-Aspect-Ratio Nanopores of Anodic Alumina by Atomic Layer Deposition
5. Conformality of Plasma-Assisted ALD: Physical Processes and Modeling
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