Microstructure of metallic copper nanoparticles/metallic disc interface in metal-metal bonding using them-Reference-Cited by-同舟云学术

Microstructure of metallic copper nanoparticles/metallic disc interface in metal-metal bonding using them

Published:2013-06-18 Issue:9 Volume:45 Page:1424-1428
ISSN:0142-2421
Container-title:Surface and Interface Analysis
language:en
Short-container-title:Surf. Interface Anal.

Author:

Kobayashi Yoshio¹,Shirochi Tsukasa¹,Maeda Takafumi¹,Yasuda Yusuke²,Morita Toshiaki²

Affiliation:

1. Department of Biomolecular Functional Engineering; College of Engineering, Ibaraki University; 4-12-1 Naka-narusawa-cho Hitachi Ibaraki 316-8511 Japan

2. Hitachi Research Laboratory; Hitachi Ltd., 7-1-1 Omika-cho Hitachi Ibaraki 319-1292 Japan

Publisher

Wiley

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/sia.5299/fullpdf

Reference36 articles.

1. Microstructural evolution and tensile properties of Sn–5Sb solder alloy containing small amount of Ag and Cu

2. Reactive wetting, evolution of interfacial and bulk IMCs and their effect on mechanical properties of eutectic Sn–Cu solder alloy

3. Development of SnAg-based lead free solders in electronics packaging

4. High temperature reliability of lead-free solder joints in a flip chip assembly

5. Damage of lead-free solder joints in flip chip assemblies subjected to high-temperature thermal cycling

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