Damage of lead-free solder joints in flip chip assemblies subjected to high-temperature thermal cycling-Reference-Cited by-同舟云学术

Damage of lead-free solder joints in flip chip assemblies subjected to high-temperature thermal cycling

Published:2012-12 Issue: Volume:65 Page:470-484
ISSN:0927-0256
Container-title:Computational Materials Science
language:en
Short-container-title:Computational Materials Science

Author:

Amalu Emeka H.,Ekere N.N.

Publisher

Elsevier BV

Subject

Computational Mathematics,General Physics and Astronomy,Mechanics of Materials,General Materials Science,General Chemistry,General Computer Science

Reference40 articles.

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5. C. Wang, F. Qin, T. An, in: Proceedings of 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010, pp. 511–514.

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