Printable Copper Sintering Paste for High-Power Die-Attach Application-Reference-Cited by-同舟云学术

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Printable Copper Sintering Paste for High-Power Die-Attach Application

Published:2023-06-26 Issue: Volume: Page:
ISSN:
Container-title:2023 China Semiconductor Technology International Conference (CSTIC)
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Author:

Ma Li¹,Li Hongyun¹,Yao Min¹,Chen Fen¹,Han Xuelian¹,Liu Yan¹

Affiliation:

1. Indium Corporation (Suzhou),Jiangsu,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10219185/10219154/10219402.pdf?arnumber=10219402

Reference8 articles.

1. Microstructure of metallic copper nanoparticles/metallic disc interface in metal-metal bonding using them

2. High power density side-gate HiGT modules with sintered Cu having superior high-temperature reliability to sintered Ag

3. Copper Die-Bonding Sinter Paste: Sintering and Bonding Properties

4. Low-Temperature and Low-Pressure Cu-Cu Bonding by Pure Cu Nanosolder Paste for Wafer-Level Packaging

5. Optimization of Solder Paste Printing Parameters Using Design Of Experiments (DOE);gopal;Jurnal Teknologi,2006

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