Copper Die-Bonding Sinter Paste: Sintering and Bonding Properties-Reference-Cited by-同舟云学术

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Copper Die-Bonding Sinter Paste: Sintering and Bonding Properties

Published:2018-09 Issue: Volume: Page:
ISSN:
Container-title:2018 7th Electronic System-Integration Technology Conference (ESTC)
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Author:

Ishikawa Dai,Nakako Hideo,Kawana Yuki,Sugama Chie,Negishi Motohiro,Ejiri Yoshinori,Ueda Suguru,An Bao Ngoc,Wurst Helge,Leyrer Benjamin,Blank Thomas,Weber Marc

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8520538/8546331/08546455.pdf?arnumber=8546455

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Review of Die-Attach Materials for SiC High-Temperature Packaging;IEEE Transactions on Power Electronics;2024-10

2. Large Area Powermodule Sintering Using Porous Copper;2024 International Conference on Electronics Packaging (ICEP);2024-04-17

3. Comparison of Mechanical Property and Thermal Cycling Lifetime of Sintered Cu and Sintered Ag;2024 International Conference on Electronics Packaging (ICEP);2024-04-17

4. Review on Shear Strength and Reliability of Nanoparticle Sintered Joints for Power Electronics Packaging;Journal of Electronic Materials;2024-03-29

5. Printable Copper Sintering Paste for High-Power Die-Attach Application;2023 China Semiconductor Technology International Conference (CSTIC);2023-06-26

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