Effects of package geometry on thermal fatigue life and microstructure of Sn–Ag–Cu solder joint
Author:
Affiliation:
1. School of Mechatronics Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China
Publisher
Informa UK Limited
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
https://www.tandfonline.com/doi/pdf/10.1179/1743284710Y.0000000031
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5. Characteristics of the Sn-Pb eutectic solder bump formed via fluxless laser reflow soldering
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