Failure mechanism models for electromigration-Reference-Cited by-同舟云学术

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Failure mechanism models for electromigration

Published:1994-06 Issue:2 Volume:43 Page:186-192
ISSN:0018-9529
Container-title:IEEE Transactions on Reliability
language:
Short-container-title:IEEE Trans. Rel.

Author:

Young D.,Christou A.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Safety, Risk, Reliability and Quality

Link

http://xplorestaging.ieee.org/ielx1/24/7286/00294986.pdf?arnumber=294986

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