Synergistic Thermal and Electron Wind Force-Assisted Annealing for Extremely High-Density Defect Mitigation
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Published:2024-06-29
Issue:13
Volume:17
Page:3188
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ISSN:1996-1944
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Container-title:Materials
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language:en
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Short-container-title:Materials
Author:
Rahman Md Hafijur1ORCID, Todaro Sarah1, Waryoba Daudi2ORCID, Haque Aman1
Affiliation:
1. Department of Mechanical Engineering, The Pennsylvania State University, University Park, PA 16803, USA 2. Engineering, Applied Materials, Penn State University, 1 College Place, DuBois, PA 15801, USA
Abstract
This study investigates the effectiveness of combined thermal and athermal stimuli in mitigating the extremely high-density nature of dislocation networks in the form of low-angle grain boundaries in FeCrAl alloy. Electron wind force, generated from very low duty cycle and high current density pulses, was used as the athermal stimulus. The electron wind force stimulus alone was unable to remove the residual stress (80% low-angle grain boundaries) due to cold rolling to 25% thickness reduction. When the duty cycle was increased to allow average temperature of 100 °C, the specimen could be effectively annealed in 1 min at a current density of 3300 A/mm2. In comparison, conventional thermal annealing requires at least 750 °C and 1.5 h. For specimens with 50% thickness reduction (85% low-angle grain boundaries), the electron wind force was again unable to anneal the defects even at 3300 A/mm2 current density and average temperature of 100 °C. Intriguingly, allowing average concurrent temperature of 200 °C eliminated almost all the low-angle grain boundaries at a current density of 700 A/mm2, even lower than that required for the 25% thickness reduced specimens. Comprehensive electron and X-ray diffraction evidence show that alloys with extremely high defect density can be effectively annealed in less than a minute at approximately 200 °C, offering a substantial improvement over conventional high-temperature annealing.
Funder
US Army Research Office Division of Materials Research, Metal & Metallic Nanostructure Program
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