The Effect of Laser Soldering onto Intermetallic Compound Formation, Growth
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Publisher
Springer International Publishing
Link
https://link.springer.com/content/pdf/10.1007/978-3-030-93441-5_12
Reference35 articles.
1. An, L., Ma, H., Qu, L., Wang, J., Liu, J., & Huang, M. (2013). The effect of laser-soldering parameters on the Sn–Ag–Cu/Cu interfacial reaction. In Paper Presented at the 2013 14th International Conference on Electronic Packaging Technology.
2. Asyraf Abdullah, M., Idris, R. A., & S. (2021). Effect of different nickel percentage in solder Alloy towards Intermetallic Compound Formation and Growth. IOP Conference Series: Materials Science and Engineering, 1092(1). https://doi.org/10.1088/1757-899x/1092/1/012012
3. Choi, W. K., Jang, S.-Y., Kim, J. H., Paik, K.-W., & Lee, H. M. (2011). Grain morphology of intermetallic compounds at solder joints. Journal of Materials Research, 17(3), 597–599. https://doi.org/10.1557/JMR.2002.0084
4. Ermer, J., Saffer, J., Schaumberger, K., Kaufmann, F., Wittmann, A., Roth, S., & Schmidt, M. (2020). Qualification of a system technology for selective laser-based quasi-simultaneous soldering with integrated pyrometric process control. Procedia CIRP, 94, 622–626. https://doi.org/10.1016/j.procir.2020.09.093
5. Gupta, P., Doraiswami, R., & Tummala, R. (2004). Effect of intermetallic compounds on reliability of Sn–Ag–Cu flip chip solder interconnects for different substrate pad finishes and Ni/Cu UBM. In Paper Presented at the 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
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