Numerical modeling and optimization of laser soldering for Micro-USB electric connector
Author:
Affiliation:
1. School of Mechanical, Electronic, and Industrial Engineering; University of Electronic Science and Technology of China; Chengdu 611731 China
2. School of Control Science and Engineer; Hebei Institute of Technology; Tianjin 300130 China
Funder
National Natural Science Foundation of China
Publisher
Wiley
Subject
Electrical and Electronic Engineering,Computer Science Applications,Modelling and Simulation
Reference22 articles.
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4. Microfabrication processes on cylindrical substrates - Part II: Lithography and connections;Snow;Microelectron Eng,2007
5. Fabrication of a 2.5 Gbps x 4 channel optical micro-module for O-PCB application;Lee;Microelectron Eng,2006
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2. Thermal Management on the Solder Joints of Adjacent Ball Grid Array (BGA) Rework Components Using Laser Soldering;Springer Proceedings in Physics;2023
3. Effect of Servo-Pressurized Mode on Soldering Process Characteristics of Micro-Parts;IEEE Access;2022
4. Numerical and experimental study on laser soldering process of SnAgCu lead-free solder;Materials Chemistry and Physics;2021-11
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