Thermal Management on the Solder Joints of Adjacent Ball Grid Array (BGA) Rework Components Using Laser Soldering
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Publisher
Springer Nature Singapore
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https://link.springer.com/content/pdf/10.1007/978-981-19-9267-4_12
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1. Laser Rework Process for Efficient Lead-Free Solder Joints Ball Grid Array (BGA) Component Rework;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-04
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