Laser Rework Process for Efficient Lead-Free Solder Joints Ball Grid Array (BGA) Component Rework-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Laser Rework Process for Efficient Lead-Free Solder Joints Ball Grid Array (BGA) Component Rework

Published:2024-04 Issue:4 Volume:14 Page:735-742
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Ismail Adlil Aizat¹^ORCID,Abu Bakar Maria²^ORCID,Jalar Azman³^ORCID,Zolkefli Zol Effendi¹,Basiron Erwan¹,Ilias Muhammad Nizam¹

Affiliation:

1. Western Digital, SanDisk Storage Malaysia Sdn. Bhd., Batu Kawan, Malaysia

2. Institute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia, Bangi, Malaysia

3. Department of Applied Physics, Institute of Microengineering and Nanoelectronics, Faculty of Science and Technology, Universiti Kebangsaan Malaysia, Bangi, Malaysia

Funder

Western Digital via SanDisk Storage Malaysia Sdn. Bhd and Universiti Kebangsaan Malaysia

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

http://xplorestaging.ieee.org/ielx7/5503870/10523000/10475384.pdf?arnumber=10475384

Reference30 articles.

1. Automated removal and replacement of surface mounted devices in electronic assembly

2. Selection and Qualification of a Local Rework Supplier

3. Reliability Analysis for High-Density PCA After Multiple BGA Reworks

4. THERMAL-INDUCED DAMAGE ON SOLDER JOINTS OF HIGH-DENSITY ADJACENT BALL GRID ARRAY COMPONENTS DURING THE REWORK PROCESS

5. Laser Soldering — Production and Microstructural Benefits for SMT

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP