Variable-Structure Proportional–Integral–Derivative Laser Solder Joint Temperature Intelligent Control Method with Adjustable Power Upper Limit
-
Published:2023-08-17
Issue:8
Volume:14
Page:1618
-
ISSN:2072-666X
-
Container-title:Micromachines
-
language:en
-
Short-container-title:Micromachines
Author:
Li Mingchao1ORCID,
Cao Pengbin1,
Zhang Cong1,
Yan Kuan1,
Zhang Yuquan2
Affiliation:
1. School of Mechanical and Electrical Engineering, Wuhan Institute of Technology, Wuhan 430205, China
2. Wuhan Fiberhome Technical Services Co., Ltd., Wuhan 430205, China
Abstract
Laser soldering is a crucial soldering technique in the realm of electronic assembly. The temperature of the solder joint is intimately connected with the quality of the solder. This paper introduces an adjustable power upper limit variable-structure Proportional–Integral–Derivative (PID) intelligent control method for regulating the temperature of the solder joint during laser soldering. Distinct laser power limits are employed for workpieces with varying heat capacities. The solder joint temperature is monitored through an infrared thermometer, which enables closed-loop temperature control via a variable-structure PID algorithm. Residual neural network (ResNet) models are utilized to predict key soldering process parameters. This method has been executed and validated on a practical testing platform. Compared to other laser soldering control techniques, the proposed method demonstrates a low overshoot, rapid dynamic response, and swift adjustment capabilities, effectively enhancing the soldering quality and production efficiency.
Funder
Gusu Innovation and Entrepreneurship Leading Talent Program
Graduate Innovative Fund of the Wuhan Institute of Technology
Wuhan’s 2022 Provincial Service Industry Development Guidance Fund Plan (Services of Wuhan Municipal Development and Reform Commission
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering
Reference34 articles.
1. (2023, June 07). Web Exclusive: Laser Soldering Compression Method for Fine-Pitch, Thin-Die Applications. Available online: https://www.laserfocusworld.com/industrial-laser-solutions/article/14221584/laser-soldering-compression-method-for-finepitch-thindie-applications.
2. Review on Application of Laser Soldering Technology to Join High Density Packaging Device with Lead-Free Solder;Xin;Weld. Join.,2007
3. Wetting Properties of Sn–Pb, Sn–Zn and Sn–Zn–Bi Lead–Free Solders;Appan;J. Teknol.,2008
4. Effect of Soldering Temperature on Wetting and Optical Density of Dip Coated Sn and Sn-3.5Ag Solders;Xu;Mater. Manuf. Process.,2015
5. Investigation on Laser Direct Welding of Quad Flat Pack Components;Yuan;J. Electron. Packag.,2013