Effect of Soldering Temperature on Wetting and Optical Density of Dip Coated Sn and Sn-3.5Ag Solders-Reference-Cited by-同舟云学术

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Effect of Soldering Temperature on Wetting and Optical Density of Dip Coated Sn and Sn-3.5Ag Solders

Published:2014-11-19 Issue:1 Volume:30 Page:127-132
ISSN:1042-6914
Container-title:Materials and Manufacturing Processes
language:en
Short-container-title:Materials and Manufacturing Processes

Author:

Xu Zengfeng,Sharma Ashutosh,Lee Soon Jae,Jung Jae Pil

Funder

The authors acknowledge the financial support provided by the Seoul R&BD Program (JP130043).

Publisher

Informa UK Limited

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

http://www.tandfonline.com/doi/pdf/10.1080/10426914.2014.952035

Reference30 articles.

1. Lead-free Solders in Microelectronics

2. The Development and Commercialization of Lead-Free Soldering

3. Effect of Multiple Reflows on the Mechanical Reliability of Solder Joint in LED Package

4. Synthesis of Copper-Alumina Composites by Mechanical Milling: An Analysis

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1. Variable-Structure Proportional–Integral–Derivative Laser Solder Joint Temperature Intelligent Control Method with Adjustable Power Upper Limit;Micromachines;2023-08-17

2. Optimization of creep and thermal features of the Sn-Ag-Cu-Zn alloy by the magnetic field;Microelectronics Reliability;2023-04

3. A review on nanodispersed lead-free solders in electronics: synthesis, microstructure and intermetallic growth characteristics;Journal of Materials Science;2022-05

4. Characterisation of Sn–3.5Ag solder/Cu joint under various reflow conditions;Materials Science and Technology;2022-03-21

5. Microstructure and properties of Sn-Ag and Sn-Sb lead-free solders in electronics packaging: a review;Journal of Materials Science: Materials in Electronics;2021-12-01

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