Investigation on Laser Direct Welding of Quad Flat Pack Components

Author:

Yuan Jianwen,Huang Chao,Chen Jimin1,Liu Furong,Qiu Yi2

Affiliation:

1. e-mail:

2. Institute of Laser Engineering, Beijing University of Technology, Beijing 100124, China

Abstract

The feasibility of laser direct welding quad flat pack (QFP) device without solder is analyzed and practiced. The relations between the tensile strength of QFP joints and laser welding parameters are investigated, and the optimized parameters are obtained. Further study of weld microstructure under the optimum parameters indicates the dependable metallurgical bonding has been formed. In accordance with the experimental parameters, the finite-element method is employed to simulate the temperature field of the welding process. The simulation results at optimum parameters of the welding spot's temperature distribution are discussed. The temperature rises linearly with the increment of loaded laser heating time, and the center temperature is rising much faster than other locations. The temperature is similar with actual measured highest temperature in this circumstance. It demonstrates the established model is satisfied, and the simulation result is reliable, which is significant to guide practical application.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Reference13 articles.

1. Tensile Strength of Fine Pitch QFP Lead-Free Soldered Joints With Diode Laser Soldering;Soldering Surf. Mount Technol.,2011

2. Formation and Distribution of Sn-Cu IMC in Lead-Free Soldering Process Induced by Laser Heating;Micro Nanosyst.,2010

3. Nishikawa, H., Takemoto, T., and Iwata, N., 2012, “Effect of Isothermal Aging on Sn-Ag-Cu Solder Joints on Electroless Ni-P/Au Plating by Laser Reflow Soldering,” IBSC 2012—Proceedings of the 5th International Brazing and Soldering Conference, Las Vegas, NV, April 22–25, pp. 1–4.

4. Laser Soldering of Fine Pitch QFP Devices Using Lead-Free Solders;ASME J. Electron. Packag,2009

5. Characterization of a Laser-Soldered Avionic Component Using Lead-Free Paste;Opt. Laser Technol.,2009

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