Photonic Interconnects for Interposer-based 2.5D/3D Integrated Systems on a Chip-Reference-Cited by-同舟云学术

Photonic Interconnects for Interposer-based 2.5D/3D Integrated Systems on a Chip

Published:2016-10-03 Issue: Volume: Page:
ISSN:
Container-title:Proceedings of the Second International Symposium on Memory Systems
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Author:

Grani Paolo¹,Proietti Roberto¹,Akella Venkatesh¹,Ben Yoo S. J.¹

Affiliation:

1. Department of Electrical & Computer Engineering, University of California, Davis, CA

Publisher

ACM

Link

Reference53 articles.

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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