A cross-layer methodology for design and optimization of networks in 2.5D systems-Reference-Cited by-同舟云学术

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A cross-layer methodology for design and optimization of networks in 2.5D systems

Published:2018-11-05 Issue: Volume: Page:
ISSN:
Container-title:Proceedings of the International Conference on Computer-Aided Design
language:
Short-container-title:

Author:

Coskun Ayse¹,Eris Furkan¹,Joshi Ajay¹,Kahng Andrew B.²,Ma Yenai¹,Srinivas Vaishnav²

Affiliation:

1. Boston University

2. UC San Diego

Funder

National Science Foundation

Publisher

ACM

Link

https://dl.acm.org/doi/pdf/10.1145/3240765.3240768

Reference32 articles.

1. DARPA CHIPS. http://www.darpa.mil/news-events/2016-07-19 DARPA CHIPS. http://www.darpa.mil/news-events/2016-07-19

2. The PARSEC benchmark suite

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1. Review of chiplet-based design: system architecture and interconnection;Science China Information Sciences;2024-07-19

2. Disintegrating Manycores;Proceedings of the 16th International Workshop on Network on Chip Architectures;2023-10-28

3. Trade-Off-Oriented Impedance Optimization of Chiplet-Based 2.5-D Integrated Circuits With a Hybrid MDP Algorithm for Noise Elimination;IEEE Transactions on Circuits and Systems I: Regular Papers;2022-12

4. TAP-2.5D: A Thermally-Aware Chiplet Placement Methodology for 2.5D Systems;2021 Design, Automation & Test in Europe Conference & Exhibition (DATE);2021-02-01

5. An Automatic Chip-Package Co-Design Flow for Multi-core Neuromorphic Computing SiPs;2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC);2020-12-02

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