Interconnect-Memory Challenges for Multi-chip, Silicon Interposer Systems
Author:
Affiliation:
1. AMD Research, Advanced Micro Devices, Inc.
2. Dept. of Electrical and Computer Engineering, University of Toronto and AMD Research, Advanced Micro Devices, Inc.
3. Dept. of Electrical and Computer Engineering, University of Toronto
Publisher
ACM
Link
https://dl.acm.org/doi/pdf/10.1145/2818950.2818951
Reference30 articles.
1. NoRD: Node-Router Decoupling for Effective Power-gating of On-Chip Routers
2. An automated design flow for 3D microarchitecture evaluation
Cited by 20 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Extending Copper Interconnects and Epoxy Dielectrics to Multi-GHz Frequencies;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-06
2. Bandwidth-Effective DRAM Cache for GPU s with Storage-Class Memory;2024 IEEE International Symposium on High-Performance Computer Architecture (HPCA);2024-03-02
3. NPRC-I/O: An NoC-Based Real-Time I/O System With Reduced Contention and Enhanced Predictability;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2023-12
4. Seizing the Bandwidth Scaling of On-Package Interconnect in a Post-Moore's Law World;Proceedings of the 37th International Conference on Supercomputing;2023-06-21
5. Overcoming Memory Capacity Wall of GPUs With Heterogeneous Memory Stack;IEEE Computer Architecture Letters;2022-07-01
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3