An automated design flow for 3D microarchitecture evaluation
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ACM Press
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Interconnect-Memory Challenges for Multi-chip, Silicon Interposer Systems;Proceedings of the 2015 International Symposium on Memory Systems;2015-10-05
2. Temperature Effects in Deep-Submicron CMOS;Stochastic Process Variation in Deep-Submicron CMOS;2013-11-14
3. 3D floorplanning of low-power and area-efficient Network-on-Chip architecture;Microprocessors and Microsystems;2011-07
4. Lagrangian Relaxation Based Inter-Layer Signal Via Assignment for 3-D ICs;IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences;2009
5. Investigating the effects of fine-grain three-dimensional integration on microarchitecture design;ACM Journal on Emerging Technologies in Computing Systems;2008-10
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