Diffusion barrier properties of sputtered TaNx between Cu and Si using TaN as the target
Author:
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Materials Science
Reference23 articles.
1. Diffusion barriers in thin films
2. Investigation of reactively sputtered TiN films for diffusion barriers
3. Interfacial reactions between aluminum and transition‐metal nitride and carbide films
4. Diffusion barrier property of TaN between Si and Cu
5. Auger Electron Spectroscopy Study on the Stability and the Interfacial Reaction of Ta, Ta-N and TaN Films as a Diffusion Barrier between Cu9Al4Film and Si
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