Investigation of reactively sputtered TiN films for diffusion barriers
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials
Reference24 articles.
1. Proc. Int. Symp. on Hybrid Microelectronics;Nelson,1969
2. TiN as a diffusion barrier in the Ti-Pt-Au beam-lead metal system
3. Investigation of titanium—nitride layers for solar-cell contacts
4. Degradation Mechanism in Si-Doped Al/Si Contacts and an Extremely Stable Metallization System
5. Suppression of platinum penetration failure in Ti/Pt/Au beam lead metal systems using a TiN diffusion barrier
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