Modification and Characterization of Interfacial Bonding for Thermal Management of Ruthenium Interconnects in Next-Generation Very-Large-Scale Integration Circuits-Reference-Cited by-同舟云学术

Modification and Characterization of Interfacial Bonding for Thermal Management of Ruthenium Interconnects in Next-Generation Very-Large-Scale Integration Circuits

Published:2022-01-31 Issue:5 Volume:14 Page:7392-7404
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Zhan Tianzhuo¹²^ORCID,Sahara Keita³,Takeuchi Haruki³,Yokogawa Ryo³,Oda Kaito²,Jin Zhicheng²,Deng Shikang²,Tomita Motohiro²,Wu Yen-Ju⁴^ORCID,Xu Yibin⁴^ORCID,Matsuki Takeo²⁵,Wang Haidong⁶,Song Mengjie⁷,Guan Sujun¹,Ogura Atsushi³,Watanabe Takanobu²^ORCID

Affiliation:

1. Toyo University, 2100 Kujirai, Kawagoe, Saitama 350-8585, Japan

2. Waseda University, 3-4-1 Ookubo, Shinjuku-ku, Tokyo 169-8555, Japan

3. Meiji University, 1-1-1 Higashi-Mita, Tama-ku, Kawasaki, Kanagawa 214-8571, Japan

4. National Institute for Materials Science, 1-2-1 Sengen, Tsukuba, Ibaraki 305-0047, Japan

5. National Institute of Advanced Industrial Science and Technology, 16-1 Onogawa, Tsukuba, Ibaraki 305-8569, Japan

6. Tsinghua University, 30 Shuangqing Road, Haidian, Beijing 100084, China

7. Beijing Institute of Technology, 5 South Street, Zhongguancun, Haidian, Beijing 100081, China

Funder

Core Research for Evolutional Science and Technology

Japan Society for the Promotion of Science

Hirose Foundation

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.1c20366

Reference71 articles.

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2. Magen, N.; Kolodny, A.; Weiser, U.; Shamir, N. Interconnect-Power Dissipation in a Microprocessor. In Proceedings of the 2004 Sixth International Workshop on System-Level Interconnect Prediction (SLIP 2004), Paris, France, February 14–15, 2004, pp. 7–13.

3. 3D Microelectronic Packaging

4. Thermal Modeling, Analysis, and Management in VLSI Circuits: Principles and Methods

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