Interfacial reactions between aluminum and transition‐metal nitride and carbide films
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.330509
Reference11 articles.
1. Diffusivity and Solubility of Si in the Al Metallization of Integrated Circuits
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4. Metallization in microelectronics
5. Electrical and mechanical features of the platinum silicide‐aluminum reaction
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