Effect of Ni and Sb additions and testing conditions on the mechanical properties and microstructures of lead-free solder joints-Reference-Cited by-同舟云学术

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Effect of Ni and Sb additions and testing conditions on the mechanical properties and microstructures of lead-free solder joints

Published:2016-07 Issue: Volume:669 Page:403-416
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Tao Q.B.,Benabou L.,Vivet L.,Le V.N.,Ouezdou F.B.

Funder

French National Research Agency ANR

VALEO

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference51 articles.

1. Implementing Lead-Free Electronics;HWang,2004

2. Mechanical properties of Pb-free SnAg solder joints;Keller;Acta Mater.,2011

3. Evolution of thermal property and creep resistance of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solders;El-Daly;Mater. Des.,2013

4. Effects of cooling rate on the microstructure and tensile behavior of a Sn-3.5wt%Ag solder;Ochoa;J. Electron Mater.,2003

5. New Pb-free solder alloy with superior mechanical properties;McCormack;Appl. Phys. Lett.,1993

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1. Improvement of heat aging resistance and tensile strength of SAC305/Cu solder joints by multi-element microalloying;Intermetallics;2024-10

2. Mechanical Characterization and Modeling of iSAC Lead-Free Solder;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

3. Nucleation and growth of Cu6Sn5 during the aging process of Cu/Sn interface in electronic packaging-by in-situ TEM;Acta Materialia;2024-01

4. Improving the Thermal Aging Resistance and Tensile Strength of Sac305/Cu Solder Joints by Adding Bi, Sb, and Ni;2024

5. Improving the Thermal Aging Resistance and Tensile Strength of Sac305/Cu Solder Joints by Adding Bi, Sb, and Ni;2024

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