Evolution of thermal property and creep resistance of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solders
Author:
Publisher
Elsevier BV
Subject
Applied Mathematics,General Mathematics
Reference20 articles.
1. Creep behavior of near-peritectic Sn–5Sb solders containing small amount of Ag and Cu;El-Daly;Mater Sci Eng A,2011
2. Revisiting mechanisms to inhibit Ag3Sn plates in Sn–Ag–Cu solders with 1wt.% Zn addition;Luo;J Alloys Compd,2010
3. Improved strength of boron-doped Sn–1.0Ag–0.5Cu solder joints under aging conditions;Choi;Intermetallics,2012
4. Low-temperature creep of SnPb and SnAgCu solder alloys and reliability prediction in electronic packaging modules;Zhang;Scripta Mater,2013
5. Creep properties of Sn–Sb-based lead-free solder alloys;El-Daly;J Alloys Compd,2009
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